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ST Engineering Upsizes its U.S. Commercial Paper Programme from US$1.5 Billion to US$3.0 Billion

Singapore, 22 December 2021 – Singapore Technologies Engineering Ltd (ST Engineering) today announced that its subsidiary, ST Engineering North America, Inc., has completed the update of the U.S. Commercial Paper Programme (Programme) established by it on 26 August 2019. With effect from 22 December 2021, the Programme limit has been increased from US$1.5 billion to US$3.0 billion.

Under this Programme, ST Engineering may from time to time issue short-term unsecured promissory notes (Notes) for a range of tenors up to 397 days. Although the proceeds of the Notes issued under the Programme will continue to be used for general corporate purposes, they may also be used as bridge financing for ST Engineering’s proposed acquisition of TransCore (the completion of which is subject to satisfaction of all conditions precedent).  

The Notes will be offered and sold exclusively to eligible investors in reliance on available exemptions under the United States Securities Act of 1933, as amended. The Notes will not be listed on any stock exchange or securities market.

This announcement is not an offer of securities for sale in the United States or elsewhere. The Notes are not being registered under the U.S. Securities Act of 1933, as amended (the “Securities Act”) and may not be offered or sold in the United States unless registered under the Securities Act or pursuant to an exemption from such registration. No public offering of the Notes is being or will be made in the United States.

 

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For media enquiries, please contact comms@stengg.com.

 

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